may 2006 rev 1 1/9 STTH506 turbo 2 ultrafast - high voltage rectifier main product characteristics features and benefits ultrafast switching low reverse current low thermal resistance reduces conduction and switching losses insulated package to-220fpac ? insulated voltage: 2500 v rms ? typical package capacitance: 12 pf description the STTH506 uses st turbo2 600v technology. this device is specially suited for use in switching power supplies, and industrial applications. order codes i f(av) 5 a v rrm 600 v t j 175 c v f (typ) 1.1 v t rr (max) 30 ns part number marking STTH506b STTH506b STTH506b-tr STTH506b STTH506d STTH506d STTH506fp STTH506fp k a to-220fpac STTH506fp k a to-220ac STTH506d k a dpak STTH506b k a nc table 1. absolute ratings (limiting values per diode at 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 600 v i f(rms) rms forward current to-220ac, to220fpac 20 a dpak 10 a i f(av) average forward current, = 0.5 t c = 145 c to-220ac, dpak 5 a t c = 120 c to-220fpac 5 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal to-220ac, to220fpac 70 a dpak 55 a t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) 175 c 1. thermal runaway condition for a diode on its own heatsink dp tot dt j --------------- 1 r th j a ? () ------------------------- - < www.st.com
characteristics STTH506 2/9 1 characteristics to evaluate the conduction losses use the following equation: p = 1.07 x i f(av) + 0.066 i f 2 (rms) table 2. thermal parameters symbol parameter value unit r th(j-c) junction to case to-220ac, dpak 3.5 c/w to-220fpac 6 table 3. static electrical characteristics symbol parameter test conditions min. typ max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 5 a t j = 150 c 13 130 v f (2) forward voltage drop t j = 25 c i f = 5 a 1.85 v t j = 150 c 1.10 1.40 1. pulse test: t p = 5 ms, < 2 % 2. pulse test: t p = 380 s, < 2 % table 4. dynamic characteristics symbol parameter test conditions min. typ max. unit t rr reverse recovery time i f = 0.5 a, i rr = 0.25 a, i r = 1 a, t j = 25 c 30 ns i f = 1 a, di f /dt = -50 a/s, v r = 30 v, t j = 25 c 35 50 i rm reverse recovery current i f = 5 a, di f /dt = -100 a/s, v r = 400 v, t j = 25 c 3.5 5 t fr forward recovery time i f = 5 a di f /dt = 100 a/s v fr = 1.1 x v fmax , t j = 25 c 180 ns v fp forward recovery voltage i f = 5 a di f /dt = 100 a/s v fr = 1.1 x v fmax , t j = 25 c 4v figure 1. conduction losses versus average current figure 2. forward voltage drop versus forward current 0 1 2 3 4 5 6 7 8 9 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 p (w) f(av) i (a) f(av) t =tp/t tp = 0.05 = 0.1 = 0.2 = 1 = 0.5 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 i (a) fm v (v) fm t =25c (maximum values) j t =150c (maximum values) j t =150c (typical values) j
STTH506 characteristics 3/9 figure 3. relative variation of thermal impedance junction to case versus pulse duration (to-220ac, dpak) figure 4. relative variation of thermal impedance junction to case versus pulse duration (to-220fpac) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 z/r th(j-c) th(j-c) t (s) p single pulse to-220ac dpak 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 z/r th(j-c) th(j-c) t (s) p single pulse to-220fpac figure 5. peak reverse recovery current versus di f /dt (typical values) figure 6. reverse recovery time versus di f /dt (typical values) 0 2 4 6 8 10 12 14 0 50 100 150 200 250 300 350 400 450 500 i (a) rm di /dt(a/s) f i =2 x i ff(av) i=i ff(av) i =0.5 x i ff(av) i =0.25 x i ff(av) v =400v t =125c r j 0 50 100 150 200 250 0 50 100 150 200 250 300 350 400 450 500 t (ns) rr di /dt(a/s) f i =2 x i ff(av) i=i f f(av) i =0.5 x i ff(av) v =400v t =125c r j figure 7. reverse recovery charges versus di f /dt (typical values) figure 8. softness factor versus di f /dt (typical values) 50 100 150 200 250 300 350 0 50 100 150 200 250 300 350 400 450 500 i =2 x i ff(av) i=i ff(av) i =0.5 x i ff(av) v =400v t =125c r j di /dt(a/s) f q (nc) rr 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 0 50 100 150 200 250 300 350 400 450 500 s factor i = 2 x i t = 125 c ff(av) j v = 400 v r di /dt(a/s) f
characteristics STTH506 4/9 figure 9. relative variations of dynamic parameters versus junction temperature figure 10. transient peak forward voltage versus di f /dt (typical values) 0.00 0.25 0.50 0.75 1.00 1.25 1.50 25 50 75 100 125 i and rm s factor q rr t (c) j i=i reference: t =125c ff(av) j v =400v r 0 2 4 6 8 10 12 14 16 18 20 22 24 26 0 100 200 300 400 500 v (v) fp di /dt(a/s) f i=i t =125c ff(av) j figure 11. forward recovery time versus di f /dt (typical values) figure 12. junction capacitance versus reverse voltage applied (typical values) figure 13. thermal resistance junction to ambient versus copper surface under tab (printed circuit board fr4, e cu = 35 m) 0 20 40 60 80 100 120 140 160 180 200 220 0 100 200 300 400 500 t (ns) fr di /dt(a/s) f i=i t =125c ff(av) j v =1.1 x v max. fr f 1 10 100 1 10 100 1000 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 35 40 r (c/w) th(j-a) s (cm2) (cu) dpak
STTH506 package mechanical data 5/9 2 package mechanical data epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.80 nm maximum torque value: 1.0 nm figure 14. dpak footprint dimensions (in mm) table 5. dpak dimensions ref. dimensions millimeters inches min. max min. max. a 2.20 2.40 0.086 0.094 a1 0.90 1.10 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b2 5.20 5.40 0.204 0.212 c 0.45 0.60 0.017 0.023 c2 0.48 0.60 0.018 0.023 d 6.00 6.20 0.236 0.244 e 6.40 6.60 0.251 0.259 g 4.40 4.60 0.173 0.181 h 9.35 10.10 0.368 0.397 l2 0.80 typ. 0.031 typ. l4 0.60 1.00 0.023 0.039 v2 0 8 0 8 h l4 g b l2 e b2 d a1 r r c a c2 0.60 min. v2 a2 6.7 6.7 3 3 1.6 1.6 2.3 2.3
package mechanical data STTH506 6/9 table 6. to-220ac dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 h2 10.00 10.40 0.393 0.409 l2 16.40 typ. 0.645 typ. l4 13.00 14.00 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. i 3.75 3.85 0.147 0.151 a c d l7 ? i l5 l6 l9 l4 f h2 g l2 f1 e m
STTH506 package mechanical data 7/9 in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. table 7. to-220fpac dimensions ref. dimensions millimeters inches min. max. min. max. a 4.4 4.6 0.173 0.181 b 2.5 2.7 0.098 0.106 d 2.5 2.75 0.098 0.108 e 0.45 0.70 0.018 0.027 f 0.75 1 0.030 0.039 f1 1.15 1.70 0.045 0.067 g 4.95 5.20 0.195 0.205 g1 2.4 2.7 0.094 0.106 h 10 10.4 0.393 0.409 l2 16 typ. 0.63 typ. l3 28.6 30.6 1.126 1.205 l4 9.8 10.6 0.386 0.417 l5 2.9 3.6 0.114 0.142 l6 15.9 16.4 0.626 0.646 l7 9.00 9.30 0.354 0.366 dia. 3.00 3.20 0.118 0.126 h a b dia l7 l6 l5 f1 f d e l4 g1 g l2 l3
ordering information STTH506 8/9 3 ordering information 4 revision history part number marking package weight base qty delivery mode STTH506b STTH506b dpak 0.3 g 75 tube STTH506b-tr STTH506b dpak 0.3 g 2500 tape and reel STTH506d STTH506d to-220ac 1.86 50 tube STTH506fp STTH506fp to-220fpac 1.8 g 50 tube date revision description of changes 18-may-2006 1 first issue.
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